发明名称 SUBSTRATE TREATING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate treating apparatus that can uniform the quality of treatment among substrates. <P>SOLUTION: The substrate treating apparatus 10 includes substrate treatment lines Lu and Ld arranged on an upper side and a lower side, each for treating substrates W while transporting the substrates W substantially horizontally. The apparatus further includes an IF section 5 for transporting the substrates W between the substrate treatment lines L and an exposure machine EXP having a plurality of exposure stages, the exposure machine being provided separately from the apparatus 10, and a controller 90 for controlling transport of the substrates W in the IF section 5 to cause all the plural substrates W similarly treated on the same substrate treatment line L to be exposed on the same exposure stage S. The apparatus can suppress variations in total quality including the treatment on the substrate treatment lines L and exposure by the exposure machine EXP among a plurality of substrates W being subjected to the same type of treatment in the same substrate treating line L. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009135292(A) 申请公布日期 2009.06.18
申请号 JP20070310675 申请日期 2007.11.30
申请人 SOKUDO:KK 发明人 OGURA HIROYUKI;MIHASHI TAKESHI;FUKUTOMI YOSHIMITSU;MORINISHI TAKEYA;KAWAMATSU YASUO;NAGASHIMA HIROJI
分类号 H01L21/027 主分类号 H01L21/027
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