发明名称 DOWNSET APPARATUS FOR LEAD FRAME
摘要 The present invention relates to a downset apparatus for a lead frame. According to the present invention, the downset apparatus for a lead frame comprises: a pressurizing member for pressurizing the lead frame; a support plate for supporting the lead frame from the bottom of the pressurizing member, and moving in the vertical direction according to the pressure of the pressurizing member; and a support for forming a downset in the lead frame by being in contact with the pressurizing member and the support plate.
申请公布号 KR101576372(B1) 申请公布日期 2015.12.09
申请号 KR20140072026 申请日期 2014.06.13
申请人 STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD. 发明人 SONG, SI WOO
分类号 H01L23/48 主分类号 H01L23/48
代理机构 代理人
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