发明名称 FILM FORMING METHOD OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a film forming method which has suitability even for the substrate thermally deformable of plastics or the like, is convenient and excellent in productivity, reforms the surface of the substrate excellent in persistence of functionality and imparts functionality.SOLUTION: A film forming method of a substrate is configured so as to successively perform the following processes (1) to (3) on the substrate: the process (1) of forming an under-coat film layer by using a composition (1) which contains a resin A having an isocyanate reactive group and an isocyanate group-containing polymerizable unsaturated compound (B); the process (2) of forming a functionality-imparting layer on the undercoat film layer formed on the process (1) by using a composition (2) which contains a functionality imparting group-containing polymerizable unsaturated compound and photopolymerization initiator; and a process (3) of applying an active energy ray onto the functionality imparting layer formed by (2).
申请公布号 JP2015213896(A) 申请公布日期 2015.12.03
申请号 JP20140170301 申请日期 2014.08.25
申请人 KANSAI PAINT CO LTD 发明人 OCHI TOSHIRO
分类号 B05D1/36;B05D3/06;B05D7/24;B32B27/16;C09D4/00;C09D5/00;C09D133/00;C09D201/06 主分类号 B05D1/36
代理机构 代理人
主权项
地址