Sn ALLOY ELECTROLYSIS PLATING METHOD AND PLATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To plate while supplying both metal ions of additional component for Sn and an alloy and to avoid replacing precipitation of the additional component at no electric conduction when Sn alloy such as Sn-Ag based alloy or Sn-Cu based alloy is electrolytic plated.SOLUTION: In a plating tank 1 pooling plating solution, a first anode 11 consisting of Sn and a second anode 12 consisting of an additional component of a Sn alloy are provided. A plated matter is electrolytic plated while the anode 11 and 12 are applied an electric current, and a surface of the first anode 11 is shielded from metal ions of the additional component in the plating solution at no electric conduction to the anode 11 and 12.