发明名称 IC CARD SUBSTRATE AND FITTED IC CARD
摘要 An IC card substrate according to an embodiment is provided with a main body with a rectangular plate shape, a recessed portion which is provided on the main body, and in which an IC card having an IC chip and a contact pattern is to be fitted, and a groove portion which is provided on the main body and ranges from the recessed portion to a side of the main body.
申请公布号 US2015347893(A1) 申请公布日期 2015.12.03
申请号 US201514722352 申请日期 2015.05.27
申请人 Kabushiki Kaisha Toshiba 发明人 Komatsu Akira
分类号 G06K19/077 主分类号 G06K19/077
代理机构 代理人
主权项 1. An IC card substrate, comprising: a main body with a rectangular plate shape; a recessed portion which is provided on the main body, and in which an IC card having an IC chip and a contact pattern is to be fitted; and a groove portion which is provided on the main body, and ranges from the recessed portion to a side of the main body.
地址 Tokyo JP