发明名称 |
IC CARD SUBSTRATE AND FITTED IC CARD |
摘要 |
An IC card substrate according to an embodiment is provided with a main body with a rectangular plate shape, a recessed portion which is provided on the main body, and in which an IC card having an IC chip and a contact pattern is to be fitted, and a groove portion which is provided on the main body and ranges from the recessed portion to a side of the main body. |
申请公布号 |
US2015347893(A1) |
申请公布日期 |
2015.12.03 |
申请号 |
US201514722352 |
申请日期 |
2015.05.27 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Komatsu Akira |
分类号 |
G06K19/077 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
1. An IC card substrate, comprising:
a main body with a rectangular plate shape; a recessed portion which is provided on the main body, and in which an IC card having an IC chip and a contact pattern is to be fitted; and a groove portion which is provided on the main body, and ranges from the recessed portion to a side of the main body. |
地址 |
Tokyo JP |