SEMICONDUCTOR DEVICE, MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MODULE

摘要

A semiconductor device includes: a semiconductor element; a frame which has a first surface, holds the semiconductor element on the first surface, and is electrically connected with the semiconductor element; and a seal which has electrical insulation properties and seals the semiconductor element and the frame, wherein a through-hole is formed in the seal, the through-hole has a hole axis which extends in a direction intersecting with the first surface, and an inner peripheral end surface of the seal exposed inside the through-hole is inclined with respect to the hole axis.

主权项

1. A semiconductor device, comprising:
a semiconductor element; a frame which has a first surface and a second surface located opposite to said first surface, holds said semiconductor element on said first surface, and is electrically connected with said semiconductor element; and a seal which has electrical insulation properties and seals said semiconductor element and said frame, wherein a through-hole is formed in said seal, said through-hole has a hole axis which extends in a direction intersecting with said first surface, and an inner peripheral end surface of said seal exposed inside said through-hole is inclined with respect to said hole axis.