发明名称 半導体装置およびその製造方法
摘要 <p>This semiconductor device (100A) includes: a substrate (1); a gate electrode (3) and a first transparent electrode (2) which are formed on the substrate (1); a first insulating layer (4) formed over the gate electrode (3) and the first transparent electrode (2); an oxide semiconductor layer (5) formed on the first insulating layer (4); source and drain electrodes (6s, 6d) electrically connected to the oxide semiconductor layer (5); and a second transparent electrode (7) electrically connected to the drain electrode (6d). At least a portion of the first transparent electrode (2) overlaps with the second transparent electrode (7) with the first insulating layer (4) interposed between them, and the oxide semiconductor layer (5) and the second transparent electrode (7) are formed out of the same oxide film.</p>
申请公布号 JP5824535(B2) 申请公布日期 2015.11.25
申请号 JP20130556350 申请日期 2013.01.24
申请人 发明人
分类号 H01L21/336;G02F1/1368;G09F9/00;G09F9/30;H01L21/3205;H01L21/768;H01L23/522;H01L23/532;H01L29/786 主分类号 H01L21/336
代理机构 代理人
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