METHOD OF PRODUCING BUMPS FROM COATED METAL POWDERS AND BUMPS PRODUCED BY THE SAME

摘要

The present invention relates to a method for forming a bump using metal powder coating and the bump formed thereby, when a stacked semiconductor package is manufactured. The method for forming the bump using the metal powder coating includes a coating step of forming a metal coating layer with another different conductive metal on the surface of the fine conductive metal powder, a spreading step of spreading the coated metal powder formed in the coating step on the upper side of a first semiconductor, an aligning step of the coated metal powder aligned on the first semiconductor by an electromagnetic field, and a heat treatment step of forming a bump with the coated metal powder by applying heat to the first semiconductor and the coated metal powder.