发明名称 |
PROGRAMMABLE STITCH CHAINING OF DIE-LEVEL INTERCONNECTS FOR RELIABILITY TESTING |
摘要 |
A method includes fabricating a set of die in a production run, each die comprising a set of pads at a periphery of a top metal layer, a first set of fuse elements, and a second set of fuse elements. Each fuse element of the first set of fuse elements couples a corresponding pad of the set to a corresponding bus when in a conductive state, and each fuse element of the second set couples a corresponding subset of pads of the set together when in a conductive state. The method further includes selecting a subset of the die of the production run for testing, and configuring each die of the subset for testing by placing each fuse element of the first set in a non-conductive state and placing each fuse element of the second set in a conductive state. |
申请公布号 |
US2015332980(A1) |
申请公布日期 |
2015.11.19 |
申请号 |
US201414276262 |
申请日期 |
2014.05.13 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
Leal George R. |
分类号 |
H01L21/66;G01R31/28;H01L23/525;G01R31/26 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
1. An integrated circuit (IC) die comprising:
a set of pads at a periphery of a top metal layer; a first set of fuse elements, each fuse element of the first set of fuse elements coupling a corresponding pad of the set to a corresponding bus when in a conductive state; and a second set of fuse elements, each fuse element coupling a corresponding subset of pads of the set together when in a conductive state. |
地址 |
Austin TX US |