| 摘要 |
PROBLEM TO BE SOLVED: To provide a tantalum sputtering target capable of accelerating a sputtering rate and improving throughput.SOLUTION: In the sputtering surface of a sputtering target manufactured by forging, recrystallizing, annealing, rolling and heat-treating a molten and cast tantalum ingot, an orientation rate of a (200) surface is 38.6-69.8%, and an orientation rate of a (222) surface is 12.1-37.8%. The method for manufacturing the tantalum sputtering target comprises: repeating rolling and heat treatment twice or more; performing cold-rolling at a rolling speed of 10 m/min or more and a rolling ratio of 65% or more and 92% or less using a reduction roll having a reduction roll diameter of 500 mm or more; and performing heat-treatment at a temperature of 900-1400°C. |
