发明名称 電子機器
摘要 PROBLEM TO BE SOLVED: To provide an electronic device having a cooling unit arranged in a case, configured to insert a pipe joint in a through hole formed in the case, to connect a refrigerant pipe extended from the cooling unit to the pipe joint, while sealing the pipe joint and the refrigerant pipe which can be relatively displaced.SOLUTION: An inverter 2 includes an electronic component, and a liquid-cooling cooling unit (laminate unit 20) for cooling the electronic component. An inverter 2 includes a case 6 with a through hole 4, and a pipe joint 10. The pipe joint 10 connects a refrigerant pipe 23 fitted to the through hole and extended from the laminate unit 20 to an external connection tube 3 arranged outside the case. The pipe joint 10 includes a rubber tube 13 having one end, an outer peripheral surface, in close contact with an inner peripheral surface of the through hole, and the other end extended toward the inside of the case. The inner peripheral surface located at the other end is close contact with an outer peripheral surface at a tip of the refrigerant tube 23. A tip of the rubber tube 13 can be displaced radially.
申请公布号 JP2015207611(A) 申请公布日期 2015.11.19
申请号 JP20140086024 申请日期 2014.04.18
申请人 发明人
分类号 H01L23/473;F25B41/00;F25D17/02;H05K7/20 主分类号 H01L23/473
代理机构 代理人
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