| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing film capable of being used without generating wrinkles and slack even when a wafer for semiconductor is repeatedly subjected to a heat.SOLUTION: The dicing film is constituted of a laminate including: a backing material containing a resin material; and an adhesive layer laminated over the backing material. The tensile elasticity of the backing material at 130°C is 1.0×10Pa or more; and the tensile elasticity thereof at 23°C is 3.0×10Pa or less. The tensile elasticity of the backing material at 23°C is 3.0×10Pa or more. The resin material is a mixture of a polypropylene and an elastomer, or a mixture of a polyethylene and an elastomer. |
