发明名称 半導体素子の特性試験装置およびその装置を用いた半導体素子の特性試験方法
摘要 <p>The invention provides a device and a method for testing the characteristics of a semiconductor element, wherein the dielectric strength and other characteristics of the resin-sealed part (15) of a semiconductor element made from a resin-sealed semiconductor chip are tested at the same time so as to reduce the test cost and the occupation space of the entire device. A voltage application means (1) used for testing the dielectric strength of the resin-sealed part (15) is in contact with the resin-sealed part (15) of the semiconductor element and a high voltage applied in a static characteristic test or a dynamic characteristic test is applied on the voltage application means (1). In this way, the test on the characteristics of the semiconductor element (such as leakage current test, voltage endurance test, L load test and the like) and the test on the dielectric strength of the semiconductor element are carried out at the same time.</p>
申请公布号 JP5817361(B2) 申请公布日期 2015.11.18
申请号 JP20110195968 申请日期 2011.09.08
申请人 发明人
分类号 G01R31/26 主分类号 G01R31/26
代理机构 代理人
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