| 发明名称 |
PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME |
| 摘要 |
A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating. |
| 申请公布号 |
US2015322574(A1) |
申请公布日期 |
2015.11.12 |
| 申请号 |
US201514804455 |
申请日期 |
2015.07.21 |
| 申请人 |
Rohm and Haas Electronic Materials LLC |
发明人 |
YEE Dennis Kwok-Wai;TANG Michael Chi-Yung;BAYES Martin W.;YIP Ka-Ming;CHAN Chun-Man;CHAN Hung-Tat;LI Tsui-Kiu;LIU Lok-Lok |
| 分类号 |
C23C18/16;C23C18/18 |
主分类号 |
C23C18/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A process for selective metallization, comprising the steps of:
(a) preparing a surface of a non-conductive material by chemically or physically modifying the surface within areas to be plated; (b) contacting the non-conductive material with a pretreatment solution comprising a conditioning agent and an alkaline material; (c) contacting the non-conductive material with a catalyst solution comprising a catalytic metal ion, an acid having at least one sulfonate group and chloride ion; and (d) electrolessly plating those areas to be plated on the surface of the non-conductive material. |
| 地址 |
Marlborough MA US |
