发明名称 焼成装置及びその制御方法
摘要 <p>A backing device (1) comprises: a laser light source (3) for emitting laser irradiated to glass paste (11) applied to draw an application pattern formed in a closed shape around a luminous surface (10a1) of a substrate (10a) of device side; moving devices (2a, 2b) for driving the substrate (10a) of device side applied with the glass paste (11); and a control device (5). And, the control device (5) moves the substrate (10a) of device side such that the glass paste (11) is irradiated with the laser along the application pattern from an irradiation start point on the application pattern. When the irradiation start point is irradiated with the laser again after laser is irradiated over the entire circumference of the application pattern, the substrate (10a) of device side is moved such that laser can be irradiated toward a location beyond the application pattern (11a).</p>
申请公布号 JP5810043(B2) 申请公布日期 2015.11.11
申请号 JP20120155003 申请日期 2012.07.10
申请人 发明人
分类号 C03C27/06;B23K26/00;H01L51/50;H05B33/04;H05B33/10 主分类号 C03C27/06
代理机构 代理人
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