| 摘要 |
A method provides a carrier used in a double-side polishing apparatus such that the carrier is disposed between upper and lower turn tables to which polishing pads are attached in the double-side polishing apparatus and holds a wafer interposed between the upper and lower turn tables in a holding hole formed in the carrier during polishing, including upper and lower main surface portions composed of a &bgr;-titanium alloy obtained from pure titanium containing 0.5 weight % or more of a &bgr;-stabilizing element. The carrier has a high abrasion resistance and can reduce its cost. |
