发明名称 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable resin composition capable of forming a cured film excellent in resolution and reflection characteristics, and a dry film and printed wiring board using the composition. <P>SOLUTION: A curable resin composition contains (A) a carboxyl group-containing resin, (B) a titanium oxide, and (C) a filler obtained by burning a hydrated silicate mineral containing aluminum or magnesium. The curable resin composition preferably has a thermosetting component and contains a photopolymerization initiator and a photosensitive monomer. (C) the filler obtained by burning the hydrated silicate mineral containing aluminum or magnesium is preferably made of pyrogenic Neuburger silica particles. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5806492(B2) 申请公布日期 2015.11.10
申请号 JP20110081296 申请日期 2011.03.31
申请人 太陽インキ製造株式会社 发明人 有馬 聖夫;米田 一善;横山 裕
分类号 C08L101/08;C08F290/00;C08F299/00;C08K3/22;C08K3/34;G03F7/004;G03F7/038;H05K3/28 主分类号 C08L101/08
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