| 摘要 |
In the manufacture of electronic devices ( 22, 22 '), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool ( 10 ) is used having a bonding tip or wedge ( 1, 2 ) at each of its opposite ends ( 11, 12 ). After extensive use of the wedge-tip ( 1 ) at one end ( 11 ) for bonding wires ( 21 ), the tip ( 1 ) is worn somewhat. Instead of needing to replace the bond tool as in the prior art, the tool ( 10 ) in accordance with the invention is then reversed to use the wedge-tip ( 2 ) at the opposite end ( 12 ) for bonding further wires ( 20 '). Thus, a cost saving is achieved with regard to tool material. |
