发明名称 |
METHOD OF MANUFACTURING SILICON WAFER |
摘要 |
<p>Provided is a silicon wafer which is stabilized in quality exerting no adverse influence on device characteristics and manufactured by restricting a boron contamination from the environment, and a manufacturing process therefor. Concretely, the silicon wafer is characterized by an attached boron amount thereon being 1 x 10<10> atoms/cm<2> or less. In order to manufacture such a wafer as contains a small amount of boron attached on the wafer surface, the wafer is treated in an atmosphere of boron concentration of 15 ng/m<3> or less. Boron-less filters and boron adsorbing filters are used as filters in a clean room and the like so as to lower the boron concentration in the atmosphere. <IMAGE></p> |
申请公布号 |
EP1143047(B1) |
申请公布日期 |
2015.11.04 |
申请号 |
EP20000961105 |
申请日期 |
2000.09.20 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
MARUYAMA, FUMIAKI;NAITO, NAOKI;UCHIYAMA, ATSUO |
分类号 |
C30B25/02;C30B29/06;F24F3/16;H01L21/02;H01L21/205 |
主分类号 |
C30B25/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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