| 发明名称 |
RESIN COMPOSITION FOR TRANSPARENT PLASTIC SUBSTRATE |
| 摘要 |
The present invention provides a resin composition for a transparent plastic substrate, comprising: (A) a silsesquioxane resin represented by chemical formula 1; and (B) a photopolymerization initiator or a thermal curing agent. |
| 申请公布号 |
WO2015163681(A1) |
申请公布日期 |
2015.10.29 |
| 申请号 |
WO2015KR03990 |
申请日期 |
2015.04.21 |
| 申请人 |
HUNET PLUS CO.,LTD |
发明人 |
CHA, HYUK JIN;PARK, JIN KYU |
| 分类号 |
C08G77/16;C08G77/42;C08L83/06 |
主分类号 |
C08G77/16 |
| 代理机构 |
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