ELECTRONIC APPARATUS, ASSEMBLY METHOD THEREOF, SHEET-LIKE STRUCTURE, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide an electronic apparatus employing a sheet-like structure capable of maintaining heat dissipation efficiency by preventing contact thermal resistance from being increased during a heat cycle.SOLUTION: The electronic apparatus includes an electronic component, a radiator, and the sheet-like structure disposed between the electronic component and the radiator. The sheet-like structure includes: a plurality of linear structures carbon atoms extending vertically to an intra-plane direction of the sheet-like structure; an adhesive layer in which a growth end of the linear structures is embedded and which adheres the sheet-like structure to the radiator; atomic layer deposited coating for covering surfaces of the linear structures protruding from the adhesive layer; and a fixing layer formed on a surface opposite to a composition plane of the adhesive layer with the radiator for coupling the linear structures in the intra-plane direction. The growth end of the linear structures is in contact with the radiator and a base of the linear structures to which the coating is applied is in contact with the electronic component.