| 摘要 |
The invention relates to devices and methods and arrays for detecting and avoiding stress cracks. One embodiment relates to a device for detecting a crack formation in a component as a result of hardening of the component under heat treatment, such as inductive hardening or flame hardening, for example, and/or resulting from straightening the component, comprising a sound sensor that can be coupled with the component to register structure-borne sound. The device is configured for the frequency-based and/or time-based evaluation of sound signals registered by the sound sensor during the hardening and/or during the straightening process. |
