发明名称 半導体モジュールおよびスイッチング素子の駆動装置
摘要 A semiconductor module includes: a semiconductor element; first and second main current passages for energizing the semiconductor element, the first and second main current passages being opposed to each other in such a manner that a first energization direction of the first main current passage is opposite to a second energization direction of the second main current passage, or an angle between the first energization direction and the second energization direction is an obtuse angle; and a coil unit sandwiched between the first and second main current passages. The coil unit includes a coil, which generates an induced electromotive force when a magnetic flux interlinks with the coil, the magnetic flux being generated when current flows through the first and second main current passages.
申请公布号 JP5796599(B2) 申请公布日期 2015.10.21
申请号 JP20130108924 申请日期 2013.05.23
申请人 株式会社デンソー 发明人 川原 英樹;今澤 孝則
分类号 H03K17/00;H01L25/00;H02M1/08;H03K17/04;H03K17/687 主分类号 H03K17/00
代理机构 代理人
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