CIRCUIT BOARD, METHOD FOR MENUFACTURING OF CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MENUFACTURING OF ELECTRONIC COMPONENT PACKAGE

摘要

In a circuit board including an insulation material and a conducive pattern formed on at least one side of the insulation material, disclosed is a circuit board with improved manufacturing efficiency and signal transmission properties while forming a fine connection path in the combination with an external device by attaching a connection pin made of a metal material for the electrical connection with the external device to one side thereof.