基板热处理装置及基板热处理装置之设置方法;SUBSTRATE HEAT TREATMENT APPARATUS, METHOD OF INSTALLING SUBSTRATE HEAT TREATMENT APPARATUS

摘要

本发明提供一种基板热处理装置，其特征为包含：运送保管单元，其包含：第1保管部以及第2保管部，其保管收纳了复数片晶圆的复数个搬运容器；以及运送机构部，其运送搬运容器；以及热处理单元，其设置了收纳以多段方式保持复数片晶圆的保持工具并对晶圆实施热处理的热处理炉；在运送保管单元的第1保管部的下方，为了将搬运容器内的晶圆移载到热处理单元的保持工具，设置了载置搬运容器的移载部之载置台；该第2保管部具有升降机构部，该升降机构部在该运送机构部的下方与该移载部相邻配置，使配置在该第2保管部的该搬运容器的高度方向之位置改变。; and a heat treatment unit including a heat treatment furnace which accommodates a holder configured to hold the plurality of wafers in multiple stages, and performs the heat treatment on the wafers. A mounting stage of a transfer section is provided below the first storage section in the conveyance storage unit. On the mounting stage, the conveyance containers are mounted so that the wafers within the conveyance containers are transferred to the holder in the heat treatment unit.