| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity, low prebaking dependency, excellent surface hardness and little development residue.SOLUTION: The photosensitive resin composition comprises (A) a polymer component including a polymer satisfying at least one of the following conditions (1) and (2), (B) a photoacid generator, (C) a ring-closed thermo-base generating compound having a specified phthalic acid amide structure, and (D) a solvent. (1) A polymer having (a1) a structural unit having a residue in which an acid group is protected by an acid decomposable group and (a2) a structural unit having a crosslinking group. (2) A polymer having (a1) a structural unit having a residue in which an acid group is protected by an acid decomposable group, and a polymer having (a2) a structural unit having a crosslinking group. |
