| 摘要 |
The present invention provides a multilayered chip component comprising: a ceramic main body including multiple dielectric layers and having first and second main surfaces, which face each other, first and second side surfaces, which face each other, and first and second sections, which face each other; an inductor part formed inside the ceramic main body including a first inner electrode, which is exposed to the first side surface and the first section, and a second inner electrode, which is exposed to the second side surface and the second section; a capacitor part formed inside the ceramic main body and including a third inner electrode, which is exposed to the first and second side surfaces, a fourth inner electrode, which is exposed to the first section, and a fifth inner electrode exposed to the second section; and first and second outer electrodes formed on the first and second sections of the ceramic main body and electrically connected to the first and second inner electrodes and the fourth and fifth inner electrodes, a third outer electrode extending from the second main surface of the ceramic main body toward the first and second side surfaces and connected to the third inner electrode, and a fourth outer electrode extending from the first main surface of the ceramic main body toward the first and second side surfaces and connected to the first and second inner electrodes, wherein the capacitor part consists of first and second capacitor parts, and the inductor part and the capacitor part are connected in parallel to each other. |
