ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER USING COMPLEXED COBALT(II) METAL ION REDUCING AGENT

摘要

A solution for electroless deposition of platinum is provided. The solution comprises Co^(2+) ions, Pt^(4+) ions, and amine ligands. The solution enables electroless deposition of platinum without requiring high temperatures and high pH. The solution enables the deposition of a pure platinum layer.