| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame having higher reliability without exposure of the base material surface in the outer periphery of a plating film serving as an external connection terminal exposed from a mold resin.SOLUTION: Each area of surface portions in contact with a die pad part 36 for mounting a semiconductor element thereon, the die pad part 36 of a base material 37 for supporting an internal terminal and an external terminal, and internal/external terminals is formed so as to be smaller than that of the die pad part 36 and the internal/external terminals. Stepped portions 30, 31 are made to be formed between the bottom surface peripheral edge of the die pad part 36 and the internal/external terminals and the surface portion of a lead frame base material 37. |
