发明名称 熱過負荷保護構造
摘要 <p>A thermal overload protection arrangement for protection of an electrical component, which is arranged on a mount device having current-carrying elements, has a plurality of soldered connections, which make electrical contact between in each case on of the current-carrying elements and an associated connection of an electrical part and melt if the component is overloaded, and a disconnection apparatus for disconnection of at least one of these connections. The part is or at least has the component, and the disconnection apparatus is a disconnection apparatus which prestresses the component with respect to the mount device at least when it is heated for the physical separation of the component from at least one of the current-carrying elements, which trips when the soldered connections melt. The invention also relates to a corresponding method for protection of a component.</p>
申请公布号 JP5789875(B2) 申请公布日期 2015.10.07
申请号 JP20130517414 申请日期 2011.08.05
申请人 发明人
分类号 H01L23/58;H01L23/62 主分类号 H01L23/58
代理机构 代理人
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