| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can correct the cleaving position and direction of a semiconductor wafer 11 so that the cleavage progresses at a nearer position and in a nearer direction to a cleavage line along which the cleavage should be originally performed when a starting point of the cleavage of the semiconductor wafer 11 is displaced.SOLUTION: A concave portion 22 is formed on at least one of first and second principal surfaces 11A, 11B in a dummy forming area of a semiconductor wafer 11 so as to be overlapped with a cleavable cleavage line 15 of the semiconductor wafer 11, the dummy forming area being, in plan view, away from an element forming area of a semiconductor wafer 11 on which a semiconductor element pattern 12 is formed. A scratch 17 is formed on the first principal surface 11A, and the semiconductor wafer 11 is cleaved along the cleavage line 15 with the scratch 17 set as a starting point. The scratch 17 is formed along the cleavage line 15 on a part of the cleavage line 15 on which the concave portion 22 is formed. |
