METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE

摘要

A resin casing is insert-molded while clamp protrusions of clamp portions formed in bonding portions of lead terminals are put between an upper mold and a lower mold. An insulating substrate which has a wiring pattern mounted with semiconductor elements is fitted into an opening portion of the resin casing and adhesively bonded to the resin casing. Electric connection between the semiconductor elements and the bonding portions of the lead terminals and between the wiring pattern on the insulating substrate and the bonding portions of the lead terminals is made by bonding wires. Thus, it is possible to provide a method for manufacturing a semiconductor device and the semiconductor device, in which stress applied to lead terminals of a lead frame formed by insert molding can be suppressed, and wire bonding properties and reliability can be improved even when the thickness of each of the lead terminals is reduced.

主权项

1. A method for manufacturing a semiconductor device including a semiconductor element received in an annular resin casing which has an opening portion and which is molded integrally with lead terminals by insert molding using at least two molds, the method comprising:
an insert molding step of placing clamp portions, which have clamp protrusions and which are formed in bonding portions of the lead terminals, on one of the molds to protrude the clamp portions into the opening portion, and insert-molding the resin casing while putting the clamp protrusions between the one mold and another mold; a substrate mounting step of fitting an insulating substrate, which has a wiring pattern mounted with the semiconductor element, into the opening portion of the insert-molded resin casing and adhesively bonding the insulating substrate and the resin casing to each other; and a wire bonding step of making electric connection between the semiconductor element and one of the bonding portions of the lead terminals and/or between the wiring pattern on the insulating substrate and another of the bonding portions of the lead terminals by bonding wires.