Base pads are spaced by a pitch on a support surface. Conducting members, optionally Cu or other metal pillars, extend up from the base pads to top pads. A top pad interconnector connects the top pads in a configuration establishing an inductor current path between the base pads.
申请公布号
WO2015148291(A1)
申请公布日期
2015.10.01
申请号
WO2015US21655
申请日期
2015.03.20
申请人
QUALCOMM INCORPORATED
发明人
ZUO, CHENGJIE;KIM, JONGHAE;KIM, DAEIK DANIEL;YUN, CHANGHAN HOBIE;VELEZ, MARIO FRANCISCO
