发明名称 |
SEMICONDUCTOR POLISHING COMPOUND |
摘要 |
To provide a semiconductor polishing compound which is excellent in dispersion stability and removal rate and which has a stabilized polishing property, as it is less susceptible to an influence even when contacted with an alkaline polishing compound during its application to CMP comprising a multistage process. A polishing compound for chemical mechanical polishing to polish a surface to be polished in the production of a semiconductor circuit device, said polishing compound comprising cerium oxide abrasive particles, water and a dicarboxylic acid represented by the formula 1: <?in-line-formulae description="In-line Formulae" end="lead"?>HOOC(CH<SUB>2</SUB>)<SUB>n</SUB>COOH Formula 1 <?in-line-formulae description="In-line Formulae" end="tail"?> wherein n is an integer of from 1 to 4, and the pH of said polishing compound at 25° C. being within a range of from 3.5 to 6.
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申请公布号 |
US2008086950(A1) |
申请公布日期 |
2008.04.17 |
申请号 |
US20070951540 |
申请日期 |
2007.12.06 |
申请人 |
ASAHI GLASS COMPANY, LIMITED;AGC SEIMI CHEMICAL CO., LTD. |
发明人 |
KON YOSHINORI;YOSHIDA IORI;NAKAZAWA NORIHITO |
分类号 |
B24D3/02;B24B1/00;B24B37/00;C09K3/14;H01L21/304 |
主分类号 |
B24D3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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