| 摘要 |
The object of the present invention is to provide a semiconductor laser module capable of reducing the burdens for the arrangement of the optical system than the conventional one. The semiconductor laser module comprises: a semiconductor laser (1) for emitting, as a transmitted light, a light with a wavelength within a certain communication wavelength band such as, for example, 1.3 ¼m band; a cooling means (2a,2b) for cooling the semiconductor laser (1); a stem (3) and cap (4) composing a package; a coupling lens (5), to which the transmitted light leaving the semiconductor laser (1) enters; an optical fiber (8), with which a coupling lens (5) is connected by fusion on its edge face, for optically coupling the transmitted light via the coupling lens (5); a lens mount piece (6) for fixing and mounting at least a portion of the coupling lens (5) or optical fiber (8); an optical fiber holder (7) for holding the optical fiber (8); and a mount substrate (9), to which the cooling means (2a,2b) and the lens mount piece (6) are disposed; wherein the coupling lens (5) consists of a first GRIN lens portion with a numerical aperture larger than or equal to that of the numerical aperture NAI of the semiconductor laser (1) multiplied by 1.4, and a second GRIN lens portion (5b) with a numerical aperture similar to that of the SMF (8). Alternatively, the second GRIN lens portion may be divided into a collimator lens portion (5c), connected by fusion with the first GRIN lens portion (5a), and a collective lens portion (5d) connected by fusion with the optical fiber (8), with an optical isolator (14) located therebetween.
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