发明名称 THERMOPLASTIC MOULDING COMPOSITION FOR THE PRODUCTION OF MOULDINGS THAT CAN BE ELECTROPLATED
摘要 The present invention relates to a thermoplastic moulding composition for the production of mouldings that can be metalized by a currentless and/or electroplating method, comprising, based on the total weight of components A, B, C, D and E, which gives a total of 100% by weight, a from 20 to 98% by weight of a thermoplastic polymer as component A, b from 1 to 30% by weight of carbon nanotubes as component B, c from 1 to 70% by weight of electrically conductive particles whose average particle diameter is from 0.01 to 100 µm as component C, d from 0 to 10% by weight of a dispersing agent as component D, and e from 0 to 40% by weight of fibrous or particulate fillers or mixtures of these as component E. The invention further relates to methods for the production of mouldings metalized by a currentless and/or electroplating method, to metalized mouldings, to the use of metalized mouldings, and also to electrically conducting components, EMI shielding systems, such as absorbers, attenuators or reflectors for electromagnetic radiation, and to gas barriers and decorative parts comprising these articles.
申请公布号 WO2008015169(A2) 申请公布日期 2008.02.07
申请号 WO2007EP57755 申请日期 2007.07.27
申请人 BASF AKTIENGESELLSCHAFT;LOCHTMAN, RENE;KACZUN, JUERGEN;SCHNEIDER, NORBERT;PFISTER, JUERGEN;WAGNER, NORBERT;KIEBURG, CHRISTOFFER;JOSHI, KETAN 发明人 LOCHTMAN, RENE;KACZUN, JUERGEN;SCHNEIDER, NORBERT;PFISTER, JUERGEN;WAGNER, NORBERT;KIEBURG, CHRISTOFFER;JOSHI, KETAN
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