| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad, preventing a polishing layer and a substrate layer from being separated in spite of using under a severe polishing condition. <P>SOLUTION: This polishing pad 11 includes: a polishing layer 13 brought into contact with a material 12 to be polished to polish the material 12 to be polished; the substrate layer 14 supporting the polishing layer 13; and an adhesive layer 15 for making the polishing layer 13 and the substrate layer 14 adhere to each other. The polishing layer 13 is provided with a slit 16 formed in the central part, thereby preventing separation of the polishing layer 13 from the substrate layer 14 due to deformation of the polishing layer 13. On the other hand, the adhesive layer 15 is disposed in the whole surface of a region enclosed by the outer periphery of the polishing layer 13, thereby covering the slit 16. <P>COPYRIGHT: (C)2008,JPO&INPIT |
