| 摘要 |
A laminated IC packaging substrate includes an intermediate connecting layer having a plurality of through holes. Each of the through holes is filled with solder material protruding from a top surface and/or a bottom surface of the intermediate connecting layer. A first circuit board having thereon a first wiring pattern is adhered to the top surface of the intermediate connecting layer using a first adhesive layer. A second circuit board having thereon a second wiring pattern is adhered to the bottom surface of the intermediate connecting layer using a second adhesive layer.
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