发明名称 Semiconductor device including a conductive layer buried in an opening and method of manufacturing the same
摘要 A trench capacitor is formed in a semiconductor substrate with a capacitor insulating film. The trench has a conductive layer as storage node electrode buried in a trench. The conductive layer includes a first, a second, and third conductive layer. The first conductive layer is buried in a lower portion of the trench. The second conductive layer is buried in a recess on the upper surface of the first conductive layer. The third conductive layer is buried to contact with the first and second conductive layers.
申请公布号 US2007085125(A1) 申请公布日期 2007.04.19
申请号 US20060638492 申请日期 2006.12.14
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 INOUE HIROFUMI;SHINOHE MASAHITO
分类号 H01L29/94 主分类号 H01L29/94
代理机构 代理人
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