An aligner holding the edge of a wafer and centering the wafer and aligning the angles of the notches of the wafer, comprising an infinitely rotatable mechanism not limited by a rotating range formed by eliminating cable and tubes from a rotating portion to reduce a tact time and the size thereof. A link mechanism openably operating a holding mechanism holding the wafer (1) is formed to be supported on a link mechanism drive part driving the link mechanism through a bearing (14) so that only the holding mechanism and the link mechanism can be rotated.
