| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive paste proper to form a via-hole conductor formed to a laminated ceramic electronic component such as a multilayer ceramic plate board. SOLUTION: In the conductive paste, each grain having a mean grain size of 0.5 to 5μm and contains substantially spherical conductive powder. The conductive paste contains an organic vehicle of 10 to 30 pts. wt. comprising ethyl cellulose as a resin component and fatty-acid amide of 0.5 to 10 pts. wt. to conductive powder of 100 pts. wt. COPYRIGHT: (C)2005,JPO&NCIPI |
