| 摘要 |
A modified latex polymer adhesive composition for use in the fabrication of flexible electronic circuitry is made by (a) preparing by emulsion polymerization an initial aqueous dispersion of an initial water-insoluble latex polymer of at least one ethylenically unsaturated monomer which comprises 0 to 2% by weight of multi-alpha, beta-ethylenically unsaturated monomer, the initial latex polymer containing essentially no other sites of ethylenic unsaturation, (b) dispersing in said initial aqueous dispersion of initial water-insoluble latex polymer additional ethylenically unsaturated monomer comprising at least one monomer having at least two sites of alpha, beta-ethylenic unsaturation, whereby said additional monomer swells said initial latex polymer, and (c) polymerizing said additional monomer within said monomer swollen initial latex polymer to form said modified water-insoluble latex polymer. |
