发明名称 METHOD FOR MANUFACTURING WIRED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing wired circuit boards which dehydrates the surface of a wired circuit board surely while preventing the disconnection of the wired circuit board. SOLUTION: With respect to the method for manufacturing wired circuit boards, a sheet 3 having a plurality of wired circuit boards 21 is water-washed in a water-washing process S1. Thereafter, the sheet 3 is so dehydrated in an immersing and bubbling process S3 included in a dehydrating process S2 as to bubble a processing liquid 10 while immersing the sheet 3 in the processing liquid 10 containing a water-soluble solvent. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009164350(A) 申请公布日期 2009.07.23
申请号 JP20080000745 申请日期 2008.01.07
申请人 NITTO DENKO CORP 发明人 MIZUSHIMA AYA;OYABU KYOYA
分类号 H05K3/26 主分类号 H05K3/26
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