发明名称 METHOD FOR MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board that can manufacture the printed wiring board in which a circuit finer than a conventional one is formed with higher reliability while reducing an environmental load. SOLUTION: In the method for manufacturing a printed wiring board, a base 3 is formed of insulating resin 1, the surface of the base 3 is coated with a resist 6, a groove 4 is formed at the base 3 to penetrate the resist 6, plating nuclei 2 are made to adhere at least to the inner surface of the groove 4, and then the resist 6 is removed. Thereafter, a circuit 5 is formed in the groove 4 by electroless plating. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009081212(A) 申请公布日期 2009.04.16
申请号 JP20070248173 申请日期 2007.09.25
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 FUJIWARA HIROAKI;YOSHIOKA SHINGO;WATANABE TOMOAKI;YAMAGUCHI MANA
分类号 H05K3/18;H05K3/00 主分类号 H05K3/18
代理机构 代理人
主权项
地址