| 摘要 |
A mold for manufacturing a semiconductor package can prevent the sweep phenomenon and void of the metal wire generated in the molding progress. The FBGA package mold for manufacturing has the low die(250) and upper mold(260). Two molds have one or more penetration type inlet port for molding material. The low die includes cavity. The semiconductor chip is adhered in the face down type. The upper mold has the inner side and outer side surface and has the second inlet port(262). The cavity(212) is equipped in the molding process. The low die comprises a plurality of first implanting globes(252) corresponding with the strip level substrate.
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