| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting device capable of shortening a cycle time when a semiconductor chip is mounted on a substrate with thermoplastic resin. <P>SOLUTION: Disclosed is the mounting device for electronic component that mounts the semiconductor chip C on the substrate 47 with the thermoplastic resin 48, and the mounting device includes a mounting tool 21 having a suction unit 25 for sucking and holding the semiconductor chip and driven in vertical directions, a heater 42 heating the suction portion, and a flow passage 26 provided to the suction unit and supplying gas for cooling the thermoplastic resin when the semiconductor chip held by the suction unit by driving the mounting tool in a lowering direction is pressed against the substrate and heated to fuse the thermoplastic resin. <P>COPYRIGHT: (C)2009,JPO&INPIT |
