发明名称 SEALING STRUCTURE OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To improve a handling property and assembling workability by increasing rigidity of a gasket 51 in a sealing structure, in which the gasket 51 is interposed between a case 11 and a lid 21 fitted with each other and forming a housing 1 of an electronic device, and in which a protrusion 31 is provided to any one of the case 11 and the lid 21, a recess 32 is provided to the other, and the gasket 51 is interposed between a protrusion tip end 31a and a recess bottom face 32a. SOLUTION: A gasket 51 is a gasket with an adhesive film. In this gasket with the adhesive film, a gasket body 55 made of a rubber elastic material is integrated with the other face of the adhesive film 52 whose one face is an adhesive face 53, the adhesive film 52 is adhered to the protrusion tip face 31a, and the gasket body 55 is brought into tight contact with the protrusion bottom face 32a. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009074643(A) 申请公布日期 2009.04.09
申请号 JP20070245458 申请日期 2007.09.21
申请人 NOK CORP 发明人 SASAKI TAKASHI
分类号 F16J15/06 主分类号 F16J15/06
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