| 摘要 |
<p>A flip-chip mounting apparatus 10 includes a variable-shape mirror 16 for receiving a laser beam emitted from a laser beam oscillating source 12, a sensor 18 for sensing a reflected laser beam from the variable-shape mirror 16, and a controlling portion 20 for controlling the variable-shape mirror 16 by comparing a sensed signal input from the sensor 18 with previously input threshold values such that an intensity distribution of the reflected laser beam corresponds to a distribution of bumps 37 on a semiconductor chip 36, whereby when the reflected laser beam from the variable-shape mirror 16 is irradiated onto the semiconductor chip 36 through a beam expander 34 and a pushing body 40, a beam shape of the reflected laser beam matches with an outer shape of the semiconductor chip 36 and also joined portions are heated in a concentrated manner.</p> |
