发明名称 |
Processing a printed wiring board by single bath electrodeposition |
摘要 |
A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
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申请公布号 |
US7846317(B2) |
申请公布日期 |
2010.12.07 |
申请号 |
US20030373350 |
申请日期 |
2003.02.24 |
申请人 |
LAWRENCE LIVERMORE NATIONAL SECURITY, LLC |
发明人 |
MELTZER MICHAEL P.;STEFFANI CHRISTOPHER P.;GONFIOTTI RAY A. |
分类号 |
C25D5/10;B32B3/00;C25D3/56;C25D3/58;C25D5/12;H05K3/06;H05K3/24 |
主分类号 |
C25D5/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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