发明名称 Processing a printed wiring board by single bath electrodeposition
摘要 A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
申请公布号 US7846317(B2) 申请公布日期 2010.12.07
申请号 US20030373350 申请日期 2003.02.24
申请人 LAWRENCE LIVERMORE NATIONAL SECURITY, LLC 发明人 MELTZER MICHAEL P.;STEFFANI CHRISTOPHER P.;GONFIOTTI RAY A.
分类号 C25D5/10;B32B3/00;C25D3/56;C25D3/58;C25D5/12;H05K3/06;H05K3/24 主分类号 C25D5/10
代理机构 代理人
主权项
地址
您可能感兴趣的专利