WAFER APPEARANCE INSPECTION DEVICE, WAFER APPEARANCE INSPECTION METHOD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve an inspection accuracy of appearance inspection by a low-cost configuration.

SOLUTION: A wafer appearance inspection device 1 has: a prober device 10 for transporting a wafer on which a plurality of semiconductor devices are formed on the same substrate to move the semiconductor device to an inspection position; a light source part (multiangle illumination 50) for irradiating the semiconductor device at the inspection position with illumination light; a camera 40 for taking an image of the semiconductor device irradiated with the illumination light; an image determination part (appearance controller 20) for inspecting the semiconductor device based on image data taken by the camera 40; and a controller (PC 30) for dividing the semiconductor device into a plurality of regions depending on a size of the semiconductor device, and sequentially moving the wafer at the inspection position at which imaging with the camera 40 is performed so as to correspond to the plurality of divided regions.

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